Meaning
Non-destructive testing methods using high-frequency sound waves allow for the internal imaging of solid objects to detect hidden defects. Application of scanning acoustic microscopy is essential for inspecting the internal structure of electronic packages and bonded materials where light cannot penetrate. The system measures the reflection of sound at the interfaces between different materials to identify gaps or cracks.
This analysis is a standard requirement for verifying the reliability of components in high-stress environments.
Acoustic Inspection
Ultrasonic transducers move over the surface of the sample while immersed in a coupling fluid like water. This fluid ensures that the sound waves pass into the material without being lost in the air.
Defect Detection
Images produced by the system show voids, delamination and cracks in the internal layers of a component. scanning acoustic microscopy is particularly effective at finding air gaps that are only a few microns thick. Because sound is sensitive to changes in density, the system can see through several millimeters of plastic or ceramic. This allows for the inspection of the bond between a silicon chip and its substrate.
Quality engineers use this data to identify manufacturing errors that could lead to premature failure in the field.
Packaging Reliability
Ensuring the integrity of the internal structure is the final step in the verification of a high-end component. scanning acoustic microscopy provides the only way to see inside a finished package without destroying it.
