Meaning
An industrial process attaches electronic components directly to the top layer of a circuit board. Surface-mount technology replaces the older method of drilling holes and soldering wires through the board. It is the standard method for building modern devices like smartphones and laptops.
Circuit Density
Techniques used in this process allow for much smaller parts to be placed very close together. Because surface-mount technology does not need holes, both sides of the board can be used to hold components. This double sided capability is what makes modern portable electronics possible.
The reduction in size does not compromise the electrical performance of the device.
Automated Speed
Placement machines can handle thousands of parts per hour with extreme precision. Surface-mount technology is much faster than manual assembly, which lowers the cost of high volume manufacturing. The speed of the process also reduces the time it takes to bring a new design to the market.
Material Efficiency
Using this method reduces the amount of material needed for each circuit board. While the initial setup for surface-mount technology is expensive, the low cost per unit makes it the most efficient choice for mass production. This efficiency has driven the price of electronics down.