Meaning
Electrical measurements taken directly from test structures on a silicon disk determine if the manufacturing process meets design tolerances. Foundries use parametric wafer probe to evaluate the physical characteristics of transistor performance. This measurement occurs at the end of the wafer processing line before the individual chips are cut into dies.
Measurement Performance
Test structures placed in the scrap area between chips provide data on resistance, capacitance and threshold voltage. Results from a parametric wafer probe indicate how well the chemicals and light have defined the micro-circuitry. If the values fall outside the guard bands, the wafer might be scrapped to prevent further investment in a faulty product.
Engineers use these metrics to fine tune the furnace settings and etch times.
Yield Prediction
Statistical analysis of the test data estimates the percentage of functional chips on the disk. When a parametric wafer probe shows uniform results across the entire surface, the expected output for the lot is high. Large variations between the center and the edge of the wafer suggest a problem with the manufacturing equipment.
Predicting the final volume of good parts allows the production team to manage inventory commitments for the next quarter.
Purchase Agreement
Contractual yields often dictate the final price paid by the customer for the processed wafers. A buyer may negotiate a lower rate if the parametric wafer probe data shows that the performance of the transistors is at the bottom of the acceptable range. These measurements become a baseline for the quality level the foundry is obligated to deliver.
Clear performance data prevents disputes over whether a batch meets the technical requirements of the design. Performance reports are shared with the client to justify the final billing amount.